Sungdong Kim

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In this study, we investigated the effects of UBM(Under Bump Metallization) and solder composition on the drop impact reliability of wafer level packaging. Fan-in type WLP chips were prepared with different solder ball composition (Sn3.0Ag0.5Cu, and Sn1.0Ag0.5Cu) and UBM (Cu 10 μm, Cu 5 μm\Ni 3 μm). Drop test was performed up to 200 cycles with 1500G(More)
Metal interconnection in the IC technologies is more important than ever for a device performance. A robust power delivery is one of scaling challenges due to increasing operating frequencies, increasing power density, and decreasing supply voltages. Especially, the on-chip power delivery problem becomes much harder as a device scales down due to the lower(More)
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