Sung Gyu Pyo

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Unlike conventional two-dimensional (2D) planar structures, signal or power is supplied through through-silicon via (TSV) in three-dimensional (3D) integration technology to replace wires for binding the chip/wafer. TSVs have becomes an essential technology, as they satisfy Moore's law. This 3D integration technology enables system and sensor functions at a(More)
Vertical light-emitting diodes (VLEDs) have attracted considerable attention owing to their improved thermal, electrical, and optical performance compared to conventional LEDs. To fabricate VLEDs, a bonding technique is required following laser lift-off. Eutectic bonding techniques are preferred owing to their low-heat mechanism and production safety.(More)
We report the optimization of ashing conditions and the process integration of a chemical vapor deposition (CVD) ultra low-k (k = 2.2) organosilicate (OSG) dielectric in a top hard mask damascene structure. The N2/H2 ash showed the lowest resistance-capacitance (RC) product and a dual top hard mask approach for dual damascene processing was built, using 200(More)
We determined that the use of densification, sacrificial oxidation, gate oxidation and source/drain implantation has the capability to reduce the dislocation. A dislocation-free process is proposed, and its mechanism presented in embedded flash memory. The dislocation decreased when n-type ions were implanted at a low energy level for source and drain. A(More)
The choice of electrode materials in lithium ion batteries and supercapacitors is important for the stability, capacity, and cycle life of the device. Despite its low capacity, graphite has often been used as an electrode material due to its inherent stability. Due to an increasing demand for large-capacity energy storage systems, there is also a demand for(More)
Promoting and employing photovoltaic power as an alternative energy source, the solar cell industry has made rapid strides. However, improving the efficiency of these solar cells using low-cost fabrication processes is still needed. The interface between the Si surface and the electrode plays a very important role in the process of electrode formation of(More)
Size-controlled PtRu nanoparticles embedded in WO3 were prepared by simultaneous multigun sputtering on pure targets of Pt, Ru, and WO3. The mean diameter of the PtRu nanoparticles, as confirmed by high-resolution transmission electron microscopy, can be varied from -2.3 to -3.6 nm by varying the RF power ratio of PtRu and WO3. On the basis of transmission(More)
Scanning probe microscopy (SPM) is considered one of the most powerful tools for nanoscale studies that are becoming increasingly important, and SPM has shown rapid development. Atomic force microscopy (AFM), in particular, is the widely used SPM system. SPM, and especially AFM, has been used as a new measuring tool for phenomena that were earlier difficult(More)
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