Suhana Binti Mohd Said

  • Citations Per Year
Learn More
Sn-Ag-Cu (SAC) alloy is currently recognized as the standard lead-free solder alloy for packaging of interconnects in the electronics industry, and highAg-content SAC alloys are the most popular choice. However, this choice has been encumbered by the fragility of the solder joints that has been observed in drop testing as well as the high cost of the Ag(More)
This study presented an experimental study of the behavior of woven glass fiber/epoxy with ply orientation (+45o/-45o/+45o)s composite laminated panels under compression. Compression tests were performed on to eighteen fiber-glass laminated plates with and without different shapes of cut-outs using the compressed machine. The maximum load of failure for(More)
This work investigates the effects of small additions (0.1 and 0.3 wt.%) of Fe on the microstructure, mechanical, and thermal properties of the Sn–1Ag–0.5Cu (SAC105) solder alloy. The addition of Fe leads to the formation of large FeSn2 intermetallic compound (IMC) particles located in the eutectic regions besides the small Ag3Sn and Cu6Sn5 IMC particles.(More)
It is believe that 80% industrial of carbon dioxide can be controlled by separation and storage technologies which use the blended ionic liquids absorber. Among the blended absorbers, the mixture of water, N-methyldiethanolamine (MDEA) and guanidinium trifluoromethane sulfonate (gua) has presented the superior stripping qualities. However, the blended(More)
Thermo-Electrochemical cells (Thermocells/TECs) transform thermal energy into electricity by means of electrochemical potential disequilibrium between electrodes induced by a temperature gradient (ΔT). Heat conduction across the terminals of the cell is one of the primary reasons for device inefficiency. Herein, we embed Poly(Vinylidene Fluoride) (PVDF)(More)
  • 1