Suhaimi Azizan

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Inside power supply, there is a regulator driver circuit which is operated at high voltage operation mode. Tiny QFN package (3 × 4 mm) had used in this study because of flexibility in lead frame design, good thermal dissipation and excellent in reliability. There are two epoxy molding compounds (EMC) were used type A and B. Lead frame was designed,(More)
The thermal conductive die attach (DA) material is very important component and it is function to create a joint between die and leadrame as well as to dissipate heat from die throughout the package. However, the dispensing DA material is giving problems, which is epoxy overflow, die tilted especially when dealing with small die size (ranging 15 to 30(More)
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