Subhomoy Chattopadhyay

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Multi-chip modules are now required to achieve higher system speed and greater density than the traditional single chip packages mounted on printed circuit boards. Algorithms for placement of bare dies and and routing of their interconnections on MCM substrates are r eviewed in this paper. Comparisons are given to point out the strengths and weaknesses of(More)
Power has become one of the most important paradigms of design convergence for future microprocessor and ASIC/SOC designs in the 65nm and smaller geometries. The amount of logic that goes on a SOC is determined by the power envelope of the part for the applications that the part would support. In this tutorial I am presenting the importance of low power(More)
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