Steven Shih

We don’t have enough information about this author to calculate their statistics. If you think this is an error let us know.
Learn More
Keywords: Through silicon via (TSV) Warpage Keep-out zone (KOZ) Mobility change Stress 3D IC package a b s t r a c t This paper aims to measure and simulate the warpages of 3D through-silicon via (TSV) die-stacked dynamic-random-access-memory (DRAM) packages during the manufacturing process. The related die stresses and keep-out zone (KOZ) for the stacked(More)
  • 1