Stephen R. Engle

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package technology and its design challenges E. D. Blackshear M. Cases E. Klink S. R. Engle R. S. Malfatt D. N. de Araujo S. Oggioni L. D. LaCroix J. A. Wakil G. G. Hougham N. H. Pham D. J. Russell This paper reviews sequential build-up (SBU) laminate substrate development from its beginning in 1988. It reports on developments in this technology for IBM(More)
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