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AN INCREASING NUMBER of integrated solutions involve the stacking of chips to reduce system size. You can find wire-bonded stacks of processors and memories in cell phones, PDAs, and flash cards. But is physical size of the system the only benefit of stacking chips? Does this minia-turization provide potential performance benefits? Until recently, practical(More)
—A 120-mV ppd low swing pulse receiver is presented for AC coupled interconnect (ACCI). Using this receiver, 3 Gb/s chip-to-chip communication is demonstrated through a wire-bonded ACCI channel with 150-fF coupling capacitors, across 15-cm FR4 microstrip lines. A test chip was fabricated in TSMC 0.18-m CMOS technology and the driver and pulse receiver(More)
This paper discusses the potential application of inductive coupling elements as backplane connectors. Tradeoffs in the choice of inductive elements are discussed and a simple circuit model for electrically large board-to-board transformers is presented. Measured data for a 10mm outer diameter transformer shows an acceptable eye opening for 400Mbps NRZ(More)
A new differential pulse receiver is demonstrated for AC coupled interconnect (ACCI), which enables the highest data rate, at 6Gb/s/channel (36Gb/s aggregate), for capacitively coupled systems using pulse signaling. The system works across FR4 printed circuit board (PCB) interconnect lengths of up to 30cm with coupling capacitors from 95fF to 165fF, while(More)
AC coupled interconnects (ACCI) enable reliable multi-Giga-b/s/channel communication with less than lOOum pin pitch, and with BER less than 10-12. This paper discusses the potential for switching noise, crosstalk and ISI control in ACCI system. I. Introduction Capacitive coupling has been demonstrated as a means to enable high data rate interconnection(More)
AC Coupled Interconnection (ACCI), in conjunction with buried solder bump technology, provides a method to achieve signal I/O pitches of less than 100 µm and signaling rates greater than 3 Gbps per I/O on integrated circuits, while preserving excellent signal integrity. This paper presents a summary of approaches and status capacitive and inductive versions(More)
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