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AN INCREASING NUMBER of integrated solutions involve the stacking of chips to reduce system size. You can find wire-bonded stacks of processors and memories in cell phones, PDAs, and flash cards. But is physical size of the system the only benefit of stacking chips? Does this minia-turization provide potential performance benefits? Until recently, practical(More)
—A 120-mV ppd low swing pulse receiver is presented for AC coupled interconnect (ACCI). Using this receiver, 3 Gb/s chip-to-chip communication is demonstrated through a wire-bonded ACCI channel with 150-fF coupling capacitors, across 15-cm FR4 microstrip lines. A test chip was fabricated in TSMC 0.18-m CMOS technology and the driver and pulse receiver(More)
Demonstrated is the fully integrated chip and package technology proposed in ACCI. ACCI provides power and ground distribution by using buried solder bump, and data transmission through capacitors formed between the chip and package. INTRODUCTON Numerous types of non-contacting, inter-chip signaling methods have been presented, such as: ACCI [1,2],(More)
This paper discusses the potential application of inductive coupling elements as backplane connectors. Tradeoffs in the choice of inductive elements are discussed and a simple circuit model for electrically large board-to-board transformers is presented. Measured data for a 10mm outer diameter transformer shows an acceptable eye opening for 400Mbps NRZ(More)
A new differential pulse receiver is demonstrated for AC Coupled Interconnect (ACCI), which enables the highest data rate, at 6Gb/s/channel (36Gb/s aggregate), for capacitively coupled systems using pulse signaling. The system works across FR4 printed circuit board (PCB) interconnect lengths of up to 30cm with coupling capacitors from 95fF to 165fF, while(More)
AC coupled interconnects (ACCI) enable reliable multi-Giga-b/s/channel communication with less than lOOum pin pitch, and with BER less than 10-12. This paper discusses the potential for switching noise, crosstalk and ISI control in ACCI system. I. Introduction Capacitive coupling has been demonstrated as a means to enable high data rate interconnection(More)
AC Coupled Interconnection (ACCI), in conjunction with buried solder bump technology, provides a method to achieve signal I/O pitches of less than 100 µm and signaling rates greater than 3 Gbps per I/O on integrated circuits, while preserving excellent signal integrity. This paper presents a summary of approaches and status capacitive and inductive versions(More)
We demonstrate multi-Gbps pulse signaling with inductively coupled interconnects across printed circuit boards and packaging interfaces. This has application in realizing sub-mm pitch Zero Insertion Force (ZIF) surface mount connectors and sockets. The signaling data rate achievable in our system is from 1Gbps to 8.5Gbps, which depends on the 3dB coupling(More)
— Fosters' canonical representation of the transfer characteristic of a linear system is the key to causal, fully convergent, incorporation of distributed structures in transient circuit simulators. The implementation of the Foster's model in the fREEDA R circuit simulator is reported and the modeling of a two-port coupled inductor is presented as an(More)
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