Stephen Mick

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498 0740-7475/05/$20.00 © 2005 IEEE Copublished by the IEEE CS and the IEEE CASS IEEE Design & Test of Computers AN INCREASING NUMBER of integrated solutions involve the stacking of chips to reduce system size. You can find wire-bonded stacks of processors and memories in cell phones, PDAs, and flash cards. But is physical size of the system the only(More)
A 120-mVppd low swing pulse receiver is presented for AC coupled interconnect (ACCI). Using this receiver, 3 Gb/s chip-to-chip communication is demonstrated through a wirebonded ACCI channel with 150-fF coupling capacitors, across 15-cm FR4 microstrip lines. A test chip was fabricated in TSMC 0.18m CMOS technology and the driver and pulse receiver dissipate(More)
Recently, several technologies have been reported using capacitive coupling to replace physical pin/solder bumps for high-density low-power chip-to-chip communications. In contrast to most of the recent results focusing on stacked ICs [3-5], the work presented here is optimized for lossy board-level capacitively coupled interconnect, and is built upon the(More)
This paper presents the potential application of AC coupled interconnect (ACCI) for dense three-dimensional (3-D) integrated circuits (ICs). The concept of inductive ACCI for 3-D ICs has been proposed. Combined with the “through vias” technology, inductive ACCI can provide small pitch vertical interconnects, as well as an excellent thermal solution for(More)
A new differential pulse receiver is demonstrated for AC coupled interconnect (ACCI), which enables the highest data rate, at 6Gb/s/channel (36Gb/s aggregate), for capacitively coupled systems using pulse signaling. The system works across FR4 printed circuit board (PCB) interconnect lengths of up to 30cm with coupling capacitors from 95fF to 165fF, while(More)
An inductively coupled interconnect scheme for vertical signaling in 3-D ICs is demonstrated. Test chips were fabricated in TSMC 0.35μm CMOS technology, then thinned and stacked. For 90μm thick chips using 150μm inductors, the transceiver communicates NRZ signals at 2.8Gb/s, and tolerates up to 50μm misalignment. TX and RX power dissipation are 10.0mW and(More)
In recent years, an increasing number of laboratories have been applying in situ heating (and ultimately, gas reaction) techniques in electron microscopy studies of catalysts and other nanophase materials. With the advent of aberration-corrected electron microscopes that provide sub-Angström image resolution, it is of great interest to study the behavior of(More)
Two issues that often impact the cryo-electron microscopy (cryoEM) specimen preparation process are agglomeration of particles near hole edges in holey carbon films and variations in vitreous ice thickness. In many cases, the source of these issues was identified to be the residues and topography often seen in commercially available films. To study and(More)