Stephan Paredes

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We address integration density in future computers based on packaging and architectural concepts of the human brain: a dense 3-D architecture for interconnects, fluid cooling, and power delivery of energetic chemical compounds transported in the same fluid with little power needed for pumping. Several efforts have demonstrated that by vertical integration,(More)
We demonstrate an advanced packaging approach with an embedded silicon micro-channel water cooler where the photovoltaic cell is electrically connected by a metallization on the silicon substrate. The backside of the silicon substrate contains the micro-machined fluidic channels thereby minimizing the thermal resistance compared to a state — of(More)
Chip microscale liquid-cooling reduces thermal resistance and improves datacenter efficiency with higher coolant temperatures by eliminating chillers and allowing thermal energy re-use in cold climates. Liquid cooling enables an unprecedented density in future computers to a level similar to a human brain. This is mediated by a dense 3D architecture for(More)
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