Steffen Michael

Learn More
In the paper a new nondestructive quality testing methods for MEMS were presented that can be applied on wafer level in early stage of the manufacturing process. The approach was applied to determine the thickness of KOH etched membranes from measured eigenfrequencies. The dynamic measurements of test specimen were performed by laser Doppler vibrometry. A(More)
Fast identification methods of pressure sensors are investigated. With regard to a complete accurate sensor parameter identification two different measurement methods are combined. The approach consists on one hand in performing static measurements – an applied pressure results in a membrane deformation measured interferometrically and the corresponding(More)
Fast identification methods of pressure sensors are investigated. With regard to a complete accurate sensor parameter identification two different measurement methods are combined. The approach consists on one hand in performing static measurements – an applied pressure results in a membrane deformation measured interferometrically and the corresponding(More)
A wafer-level testing method is investigated for an early stage of the manufacturing process applied to accelerometers. The approach consists of performing optical measurement of the modal responses of the MEMS structures, and uses this information in an inverse identification algorithm based on a FE model. Device characteristics can be determined by(More)
A fast identification method of membrane structure parameters is investigated for an early stage of the manufacturing process. The approach consists of performing optical measurement of the modal responses of the membrane structures. This information is used in an inverse identification algorithm based on a FE model. Device characteristics can be determined(More)
  • 1