Srinivasa Banna

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Articles you may be interested in Bandgap measurements of low-k porous organosilicate dielectrics using vacuum ultraviolet irradiation Appl. The effect of water uptake on the mechanical properties of low-k organosilicate glass Mechanism of plasma-induced damage to low-k SiOCH films during plasma ashing of organic resists Plasma damage effects on low-k(More)
In this paper, we develop tier partitioning strategy to mitigate back-end-of-line (BEOL) interconnect delay degradation and cost issues in monolithic 3D ICs (M3D). First, we study the routing overhead and delay degradation caused by tungsten BEOL interconnect in the bottom-tier of M3D. Our study shows that tungsten BEOL reduces performance by up to 30% at(More)
In this paper we study the impact of low thermal budget process on design quality in monolithic 3D ICs (M3D). Specifically, we quantify how much the tier-to-tier transistor performance difference affects full-chip power and performance metrics in a foundry 14nm FinFET technology. Our study first shows that 5%, 10%, and 15% top-tier device degradation in a(More)
In this work, experimental measurements of the electronic band gap of low-k organosilicate dielectrics will be presented and discussed. The measurement of bandgap energies of organosilicates will be made by examining the onset of inelastic energy loss in core-level atomic spectra using X-ray photoelectron spectroscopy. This energy serves as a reference(More)
More and more high-and low-k dielectrics are used in microfabrication today. However, as is well known, these materials are easily damaged during processing or during operation in a device. Sources of damage include plasma and/or VUV exposure, water uptake, free radicals as well as cosmic rays. A description of the damage effects on dielectrics from water(More)
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