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Flatness of the incoming silicon wafer is one major contributor to the ultimate focusing limitation of modern exposure tools. Exposure tools are designed to chuck wafers without creating non-flatness… Continue Reading
To realize improved process control at high productivity, the TWINSCAN platform has been developed. This dual stage lithography system combines high throughput TWINSCAN technology with excellent… Continue Reading
To realize high productivity at the 100-nm node, ASML developed the TWINSCAN TM AT:1100B. This dual-stage 193-nm lithography system combines high throughput TWINSCAN TM technology for 300-mm wafers,… Continue Reading
To realize high productivity at the 100 nm node, ASML developed the TWINSCANTM AT:1100B. This dual stage 193 nm lithography system combines high throughput TWINSCANTM technology for 300 nm wafers,… Continue Reading