Sin Heng Lim

We don’t have enough information about this author to calculate their statistics. If you think this is an error let us know.
Learn More
  • Lie Liu, Sung Yi, +4 authors Fei Su
  • IEEE Transactions on Electronics Packaging…
  • 2005
The reaction kinetics of microwave cure process of underfill materials in flip-chip packaging was investigated with nonisothermal kinetic method and compared with that of the thermal cure. Three-dimensional (3-D) nonlinear cure kinetic and transient heat transfer coupled model was solved by finite-element method (FEM) to simulate the microwave cure process.(More)
  • 1