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  • Youssef Travaly, J. van Aelst, +20 authors G. P. Beyer
  • Materials Science
  • International Interconnect Technology Conference
  • 2008 (First Published: 1 June 2008)
  • Interconnect solutions for advanced technology nodes using PECVD techniques for low-k deposition require the use of porogen-based process with post deposition UV cure. By using two different UV cureContinue Reading