Shengcheng Wang

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—In recent years, interconnect issues emerged as major performance challenges for Two-Dimensional-Integrated-Circuits (2D-ICs). In this context, Three-Dimensional-ICs (3D-ICs), which consist of several active layers stacked above each other, offer a very attractive alternative to conventional 2D-ICs. However, 3D-ICs also face many challenges associated with(More)
The manufacturing yield challenge of three-dimensional integrated circuit (3D ICs) is one of the key obstacles in the industry adoption of 3D integration based on through-silicon-vias (TSVs). The addition of spare TSVs to repair faulty functional TSVs is an effective method for yield and reliability enhancement, but this approach results in significant(More)
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