Shari Farrens

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3D integration technologies include wafer level, die-to-wafer and die-to-die processing flows. The performance gains achieved by vertical stacking of devices are independent of substrates size and technology. All applications report enhanced transmission speeds, lower power consumption, better performance, and smaller form factors to name a few of the(More)
INTRODUCTION We have developed plasma dicing technology as an alternative dicing technology of conventional mechanical (blade) dicing. The main advantages of plasma dicing over the conventional dicing are “damage free”, “chipping free”, “particle free”, “water free” and “heat free”. We will introduce the features of plasma dicing process and its(More)
Technology roadmaps for electronic packaging and 3D integration show the continuing trend of increasing input/output connection density between the semiconductor chip and the package or between two different IC’s. For FlipChip packaging applications, 150μm pitch full grid solder bump arrays have already entered production. Bump pitch requirements for 3D(More)
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