Shao-feng Xie

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Failure modes and failure mechanisms under external stress generated by high temperature, electricity and moisture were studied with 0.13-μm/6-level copper-based FPGA with FC-PBGA package. Case Studies and the results indicate that FC-PBGA devices have three main kinds of failure modes: Vcc electrically short to GND, Vcc+ electrically short to Vcc-(More)
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