Seonsik Kim

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This paper investigates the failure mechanism of Fine-pitch Ball Grid Array (FBGA) solder joints of memory modules due to harmonic excitation by the experiments and the finite element method. A finite element model of the memory module was developed, and the natural frequencies and modes were calculated and verified by experimental modal testing. Modal(More)
0026-2714/$ see front matter 2013 Elsevier Ltd. All rights reserved. http://dx.doi.org/10.1016/j.microrel.2013.06.018 ⇑ Corresponding author. Address: PREM, Department of Mechanical Engineering, Hanyang University, 17, Haengdang-dong, Seondong-gu, Seoul 133-791, Republic of Korea. Tel.: +82 2 2220 0431; fax: +82 2 2292 3406. E-mail address:(More)
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