Seonsik Kim

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This paper investigates the failure mechanism of Fine-pitch Ball Grid Array (FBGA) solder joints of memory modules due to harmonic excitation by the experiments and the finite element method. A finite element model of the memory module was developed, and the natural frequencies and modes were calculated and verified by experimental modal testing. Modal(More)
This paper investigates the effect of solder pad size on the fatigue life of fine-pitch ball grid array (FBGA) solder joints in memory modules due to harmonic excitation by using a global–local modeling technique. Finite element analysis of a memory module requires enormous computer memory and computational time because some components such as solder balls(More)
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