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Power dissipation is unevenly distributed in modern microprocessors leading to localized hot spots with significantly greater die temperature than surrounding cooler regions. Excessive junction temperature reduces reliability and can lead to catastrophic failure. We examine the use of activity migration which reduces peak junction temperature by moving(More)
—An 8 Gb 4-stack 3-D DDR3 DRAM with through-Si-via is presented which overcomes the limits of conventional modules. A master-slave architecture is proposed which decreases the standby and active power by 50 and 25%, respectively. It also increases the I/O speed to 1600 Mb/s for 4 rank/module and 2 module/channel case since the master isolates all chip I/O(More)
This paper explores the power implications of replacing global chip wires with an on-chip network. We optimize network links by varying repeater spacing, link pipelining, and voltage scaling, to significantly reduce the energy to send a bit across chip. We develop an analytic model of large chip designs with an on-chip two-dimensional mesh network and(More)
Leakage power is dominated by critical paths, and hence dynamic deactivation of fast transistors can yield large savings. We introduce metrics for comparing fine-grain dynamic deactivation techniques that include the effects of deactivation energy and startup latencies, as well as long-term leakage current. We present a new circuit-level technique for(More)
paper presents new techniques to evaluate the energy and delay of flip-flop and latch designs and shows that no single existing design performs well across the wide range of operating regimes present in complex systems. We propose the use of a selection of flip-flop and latch designs, each tuned for different activation patterns and speed requirements. We(More)
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