Scott Suko

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Supply-chain traceability and electronics counterfeiting have become increasingly widespread issues for military and commercial electronics systems. In response to a DARPA SHIELD program directive, Northrop Grumman is leading a team to develop tiny, passive, near-field RFID chips, called dielets, which will be embedded in electronic component packaging. The(More)
A 10GHz high efficiency transmitter with wideband supply modulation is developed under the DARPA MPC program. The technology is implemented for envelop restoring modulation by integrating a contour modulated class E PA and a split-band power supply. This method allows for a wide modulation envelope bandwidth without significant efficiency penalty.
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