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We investigated the utility of the Cambridge Behavioural Inventory (CBI), a carer-completed questionnaire, in a large cohort with Parkinson's disease (PD) (n = 215). In a sub-cohort of 112 patients with PD, the CBI was found to be a valid instrument compared with the Neuropsychiatric Inventory, PDQ-39 and UPDRS, with high internal consistency. Furthermore,(More)
Electronic commerce and associated business-to-business transaction capabilities have changed the way in which the supply chain operates. The Internet has enabled information exchange on an unprecedented scale, often at a pace too fast for normal consumption. Companies are not equipped to make effective use of data from warehouse and transportation(More)
In this research, we model a semiconductor wafer fabrication process as a complex job shop, and adapt a Modified Shifting Bottleneck Heuristic (MSBH) to facilitate the multi-criteria optimization of makespan, cycle time, and total weighted tardiness using a desirability function. The desirability function is implemented at two different levels of the MSBH:(More)
BACKGROUND Infection with Helicobacter pylori is the main cause of peptic-ulcer disease. Treatment of this infection might lower the prevalence of dyspepsia in the community and improve quality of life. We investigated this possibility in a double-blind randomised controlled trial. METHODS Individuals aged 40-49 years were randomly selected from the lists(More)
This paper describes how a large number of products are scheduled to run in parallel on a pool of wire-bond machines to meet weekly demand. We seek to maximize demand fulfillment subject to system constraints. The schedule is generated by a simulation engine and used to control the machines at execution time and also to plan for the start of material. By(More)
The standard unit of transfer in new semiconductor wafer fabrication facilities is the front opening unified pod (FOUP). Due to automated material handling system and cost concerns, the number of FOUPs in a wafer fab is kept limited. Large 300-mm wafers allow for customer orders to be filled with less than a full FOUP of wafers in these new fabs, thereby(More)