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Journals and Conferences
The benefits of copper (Cu) die-side bumps for flip chip application are well known and have been sought for more than a decade. However, the introduction of fragile low-k interlayer dielectrics… (More)
Interconnect process features are described for a 45nm high performance logic technology. Through extensive use of highly manufacturable carbon doped oxide low-k dielectric layers and aggressive… (More)
The thermomechanical interaction of organic flip chip assembly is primarily driven by the coefficient of thermal expansion (CTE) mismatch between die and package. This, in addition to emerging… (More)
To report a rare case of bilateral morning glory disc anomaly and to evaluate the Angio OCT characteristics of macula and the optic disk in a case of bilateral morning glory disk anomaly.
PURPOSE To describe our experience with management of eyes with stage 5 retinopathy of prematurity (ROP). METHODS Closed vitreoretinal surgery was done on 96 eyes of patients with stage 5 ROP. Lens… (More)
OBJECTIVE This study was aimed at assessing changes at the sclerotomy site using the ultrasound biomicroscope (UBM) in eyes that underwent primary pars plana vitrectomy for complications of… (More)
AIM To image the radial peripapillary capillary (RPC) network with optical coherence tomography angiography (OCTA) and measure its capillary density (CD) in the normal human retina. MATERIALS AND… (More)
To report a case of surgical site infection of Phacoemulsification tunnel infection managed with a partial thickness corneal patch graft in a 73 year old patient.