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This paper presents for the first time a novel manufacturing-compatible organic substrate and interconnect technology using ultra-thin chip-last embedded active and passive components for digital, analog, MEMS, RF, microwave and millimeter wave applications. The architecture of the platform consists of a low-CTE thin core and minimum number of thin build up(More)
This paper introduces a new developmental family of thin film dielectric materials that have low dielectric constant (2.5 - 3.1 ) and low loss tangent (<0.005) at 10 GHz and discusses process development and reliability testing of a 1-2-1 substrate stack-up with versions of these high-performance developmental dielectrics (RXP-4). The variant used in(More)
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