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This paper reviews the possible causes and effects for no-fault-found observations and intermittent failures in electronic products and summarizes them into cause and effect diagrams. Several types of intermittent hardware failures of electronic assemblies are investigated, and their characteristics and mechanisms are explored. One solder joint intermittent(More)
This study investigates the effects of printed circuit board (PCB) material on interconnect durability of lead free assemblies. The assemblies involve soldering various packages (array and peripheral) on to FR4, high glass transition temperature (T g) FR4 and Polyimide (PI) printed circuit boards using Sn3Ag0.5Cu solder alloy. The glass transition(More)
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