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Physics-augmented Neural Compact Model for Emerging Device Technologies
This paper proposes a novel compact modeling framework based on artificial neural networks and physics informed machine learning techniques. This physics- augmented neural compact model shows highlyExpand
  • 1
A Novel Approach for Semiconductor Etching Process with Inductive Biases
  • Sanghoon Myung, Hyunjae Jang, +5 authors Dae Sin Kim
  • Computer Science, Mathematics
  • ArXiv
  • 6 April 2021
We introduce the state-of-the-art deep learning model to predict the etching profiles for semiconductor etching process. Expand
Real-Time TCAD: a new paradigm for TCAD in the artificial intelligence era
This paper presents a novel approach to enable real-time device simulation and optimization. Expand