Sang-Su Ha

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In this study, the effect of Ag content (1.8 & 2.3 wt.%) on the electromigration lifetimes and microstructure evolution of Sn-Ag solder bumps were investigated at highly accelerated electromigration test conditions. Electromigration of solder joint under high current stressing has been an important concern of the reliabilities in solder joint system,(More)
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