Sandy Bennemann

Suggest Changes
  • Citations Per Year
Learn More
In this paper, methods for high resolution analysis of the intermetallics formed in the interfaces of microelectronic packaging interconnects are discussed. The application of Transmission Electron(More)
The paper demonstrates that new failure modes can be analyzed and understood if an improved comprehensive flow in diagnostics involving non-destructive failure localization, ion-beam-supported target(More)
  • 1