Sandeep Kumar Samal

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—Monolithic 3D ICs (M3D) are an emerging technology that offers an ultra-high-density 3D integration due to the extremely small size of monolithic inter-tier vias. We explore various design styles available in M3D and present design techniques to obtain GDSII-level signoff quality results for each of these styles. We also discuss various challenges facing(More)
In this paper, we present a comprehensive study on the impact of power delivery network (PDN) on full-chip wirelength, routability, power, and thermal effects in monolithic 3D ICs. Our studies first show that the full PDN worsens routing congestion more severely in monolithic 3D ICs than in 2D designs due to the significant reduction in resources for 3D(More)
In this paper, we present a comprehensive study of the unique thermal behavior in monolithic 3D ICs. In particular, we study the impact of the thin inter-layer dielectric (ILD) between the device tiers on vertical thermal coupling. In addition, we develop a fast and accurate compact full-chip thermal analysis model based on non-linear regression technique.(More)
In this paper, we study a 3D IC micro-controller implemented with sub-threshold supply for ultra-low power applications. Our study is based on GDSII layouts of a sub-threshold 8052 micro-controller that consumes 3.6&mu;<i>W</i> power running at 20 KHz clock frequency and 0.4V logic supply. Our study confirms that sub-threshold circuits indeed offer a few(More)
In this paper, we develop tier partitioning strategy to mitigate back-end-of-line (BEOL) interconnect delay degradation and cost issues in monolithic 3D ICs (M3D). First, we study the routing overhead and delay degradation caused by tungsten BEOL interconnect in the bottom-tier of M3D. Our study shows that tungsten BEOL reduces performance by up to 30% at(More)
In this paper we study the impact of low thermal budget process on design quality in monolithic 3D ICs (M3D). Specifically, we quantify how much the tier-to-tier transistor performance difference affects full-chip power and performance metrics in a foundry 14nm FinFET technology. Our study first shows that 5%, 10%, and 15% top-tier device degradation in a(More)
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