Sandeep Chatterjee

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Exceptions have traditionally been used to handle infrequently occurring and unpredictable events during normal program execution. Current trends in microprocessor and operating systems design continue to increase the cost of event handling. Because of the deep pipelines and wide out-of-order superscalar architec-tures of contemporary microprocessors, an(More)
Electromigration (EM) is re-emerging as a significant problem in modern integrated circuits (IC). Especially in power grids, due to shrinking wire widths and increasing current densities, there is little or no margin left between the predicted EM stress and that allowed by the EM design rules. <i>Statistical Electromigration Budgeting</i> (SEB) estimates(More)
This paper is an exhaustive review summarizing the results, observations and findings of the renowned researchers in the domain of Web Service Discovery. After extensive scavenging on the Internet, we felt that there is a paucity of good quality survey papers, which can help, provide directions to a researcher looking for a fertile area to explore in the(More)
Electromigration (EM) in the on-die metal lines has re-emerged as a significant concern in modern VLSI circuits. The higher levels of temperature on die and the very large number of metal lines, coupled with the conservatism inherent in traditional EM checking strategies, have led to a situation where trying to guarantee EM reliability often leads to(More)
This paper presents ultra low power implementation of eight-point 2-D DCT (Discrete Cosine Transform) based on a Loeffler DCT scheme. The proposed implementation scheme does not require any multiplier as well as scaling compensation in the computation. The constant coefficient in the rotation blocks are represented in CSD (Canonic Signed Digit) and the(More)
We present a system architecture and framework for creating rapidly deployable intelligent environments. The rapid pace of innovation of computer hardware and intelligent systems software leads to uncertainty that deters manufacturers from adopting a single processor, network, or software environment for placement into their products. The MASC Composable(More)
Due to technology scaling, electromigration (EM) signoff has become increasingly difficult, mainly due to the use of inaccurate methods for EM assessment, such as the empirical Black's model. In this paper, we present a novel approach for EM checking using physics-based models of EM degradation, which effectively removes the inaccuracy, with negligible(More)
Electromigration (EM) in on-die metal lines is becoming a significant problem in modern integrated circuits technology. Due to the high levels of current density on the die, the large number of metal lines, and the inherent conservatism in classical full-chip EM models, designers are finding it very hard to meet the area and design specs while guaranteeing(More)