Sandeep Chatterjee

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Exceptions have traditionally been used to handle infrequently occurring and unpredictable events during normal program execution. Current trends in microprocessor and operating systems design continue to increase the cost of event handling. Because of the deep pipelines and wide out-of-order superscalar architec-tures of contemporary microprocessors, an(More)
Electromigration (EM) is re-emerging as a significant problem in modern integrated circuits (IC). Especially in power grids, due to shrinking wire widths and increasing current densities, there is little or no margin left between the predicted EM stress and that allowed by the EM design rules. <i>Statistical Electromigration Budgeting</i> (SEB) estimates(More)
Electromigration (EM) in the on-die metal lines has re-emerged as a significant concern in modern VLSI circuits. The higher levels of temperature on die and the very large number of metal lines, coupled with the conservatism inherent in traditional EM checking strategies, have led to a situation where trying to guarantee EM reliability often leads to(More)
—Electromigration (EM) in on-die metal lines is becoming a significant problem in modern integrated circuits technology. Due to the high levels of current density on the die, the large number of metal lines, and the inherent conservatism in classical full-chip EM models, designers are finding it very hard to meet the area and design specs while guaranteeing(More)
Due to technology scaling, electromigration (EM) signoff has become increasingly difficult, mainly due to the use of inaccurate methods for EM assessment, such as the empirical Black's model. In this paper, we present a novel approach for EM checking using physics-based models of EM degradation, which effectively removes the inaccuracy, with negligible(More)
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