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Two dimensional arrays of monodispersed Ag-nanoparticles separated by different gaps with sub-10 nm precision are fabricated on anodic alumina substrates with self-organized pores. Light scattering spectra from the arrays evolve with the gaps, revealing plasmonic coupling among the nanoparticles, which can be satisfactorily interpreted by analytical(More)
A high fidelity electrochemical replication technique for the rapid fabrication of Al nanostructures with 10 nm lateral resolution has been successfully demonstrated. Aluminum is electrodeposited onto a lithographically patterned Si master using a non-aqueous organic hydride bath of aluminum chloride and lithium aluminum hydride at room temperature.(More)
We report sample preparation and FIB-SEM investigation of polymer-microlens/CFA arrays of CMOS image sensor for investigating possible nanoscale voids. Polymer staining was employed to delineate boundaries of color filters and microlenses. Newly developed in-house auto-metrology software was used for dimension and uniformity study of SEM images of(More)
A fast electrochemical replication technique has been developed to fabricate large-scale ultra-smooth aluminum foils by exploiting readily available large-scale smooth silicon wafers as the masters. Since the adhesion of aluminum on silicon depends on the time of surface pretreatment in water, it is possible to either detach the replicated aluminum from the(More)
Failure analysis of metal layers (open or short) in semiconductor industry is performed primarily by OBIRCH, thermal imaging, and SQUID technology which show resolution of few microns, only. Here, we present a current imaging technique to isolate the fault by biasing part of the metal lines with AFM tips and scanning another conductive AFM tip in the(More)
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