Saekyoung Kang

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An optical interconnection plate was developed in order to achieve a compact and cost-effective interconnection module for an optical data link between chips on printed circuit boards. On the silica substrate, transmission lines and solder bumps are formed on the top surface of the substrate, and polymer waveguide array with 45/spl deg/ mirror planes is(More)
In this paper, a new architecture for a chip-to-chip optical interconnection system is demonstrated that can be applied in a waveguide-embedded optical printed circuit board (PCB). The experiment used 45/spl deg/-ended optical connection rods as a medium to guide light paths perpendicularly between vertical-cavity surface-emitting lasers (VCSELs), or(More)
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