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In-situ micro bend testing of SiC and the effects of Ga + ion damage
The Young's modulus of 6H single crystal silicon carbide (SiC) was tested with micro cantilevers that had a range of cross-sectional dimensions with surfaces cleaned under different acceleratingExpand
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Focused ion beam preparation of microbeams for in situ mechanical analysis of electroplated nanotwinned copper with probe type indenters
Summary A site‐specific xenon plasma focused ion beam preparation technique for microcantilever samples (1–20 µm width and 1:10 aspect ratio) is presented. The novelty of the methodology is the useExpand
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Structural integrity and damage of ZrB2 ceramics after 4 MeV Au ions irradiation
Abstract Ultra-high temperature ceramics have been considered as good candidates for plasma facing materials due to their combination of high melting point, high strength and hardness, high thermalExpand
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3D structure design of magnetic ferrite cores using gelcasting and pressure-less sintering process
Gelcasting is a well established process for ceramics manufacturing which recently has been proved to be successful for soft ferrites as well. This approach is particularly interesting for powerExpand
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Further Enhancement of Thermal Conductivity through Optimal Uses of h-BN Fillers in Polymer-Based Thermal Interface Material for Power Electronics
Due to the demand of miniaturization and increasing functionality in power electronics, thermal dissipation becomes a challenging problem for thermal management and reliability. To enable effectiveExpand
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Formation of twins in AlON material and its effects on the Vickers hardness and fracture toughness
Abstract Aluminum oxynitride (γ-AlON) powders were synchronously synthesized by carbothermal reduction-nitridation (CRN) and high-temperature solid state reaction (SSR) methods. Twin structuresExpand
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Structural integrity and characteristics at lattice and nanometre levels of ZrN polycrystalline irradiated by 4 MeV Au ions
We report an as-hot-pressed zirconium nitride polycrystalline with its primary crystal structure maintained no change but lattice defects and features were introduced at nanometre-scale after beingExpand
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Surface engineering alumina armour ceramics with laser shock peening
Abstract Laser shock peening (LSP) of Al2O3 armour ceramics is reported for the first-time. A 10 J, 8 ns, pulsed Nd:YAG laser with a 532 nm wavelength was employed. The hardness, KIc, fractureExpand
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Cu-Cu Bonding with Cu Nanowire Arrays for Electronics Integration
Due to the demand of miniaturization and high reliability, heterogeneous integration of wide band gap semiconductors requires advanced interconnect materials that enable optimum designs of componentExpand
Quasi-ambient Bonding Semiconductor Components for Power Electronics Integration
  • Yi Zhong, Allan Liu, +4 authors C. Liu
  • Materials Science
  • IEEE 70th Electronic Components and Technology…
  • 1 June 2020
Multiple components stacking is a key technology to enable power electronics integration wherein components are stacked through planar bonding. The commonly used reflow soldering present drawback ofExpand
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