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  • J. C. Hsieh, H. J. Huang, S. C. Shen
  • Engineering, Computer Science
  • Microelectronics Reliability
  • 2012 (First Published: 1 June 2012)
  • Abstract The paper presents a novel concept for a coronary-stent-like model to solve the problem of compactness between wick and copper mesh, which can enhance the performance of the hybrid structureContinue Reading