S. Zaghi

Learn More
We have successfully used hydrophobic direct-wafer bonding, along with H-induced layer splitting of Ge, to transfer 700-nm-thick, single-crystal Ge (100) films to Si (100) substrates without using a metallic bonding layer. The metal-free nature of the bond makes the bonded wafers suitable for subsequent epitaxial growth of triple-junction GaInPyGaAsyGe(More)
Force feedback sensors are useful for the planning of robotic digging trajectories. In particular, when combined with force-control algorithms it becomes possible to sense buried objects and to determine the weight of excavated materials. The proposed force sensor system makes use of hydraulic cylinder pressure and thereby measures machine force indirectly.(More)
  • 1