S. W. Liang

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OBJECTIVE Past studies have found that environmental stress affects cellular immune function and that extensive variability exists in the magnitude and direction of stress-induced immune changes. Past research also suggests that individuals with greater right, relative to left, resting frontal electroencephalogram (EEG) activation perceive environmental(More)
Three dimensional thermo-electrical analysis was employed to simulate the current density and temperature distributions for eutectic SnAg solder bumps with shrinkage bump sizes. It was found that the current crowding effects in the solder were reduced significantly for smaller solder joints. Hot-spot temperatures and thermal gradient were increased upon(More)
Solder joints with Cu columns appear to be one of the best structures to resist electromigration. Three-dimensional thermoelectrical analysis was employed to simulate the current density and temperature distributions for eutectic SnPb solder bumps with 0.5, 5, 25, 50, and 100 lm Cu under bump metalli-zation (UBM). It was found that the hot spots and current(More)
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