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We have designed a robust two-state filter for infrared gas measurement, where the filter transmittance alternates between a single bandpass function, and a double-band offset reference. The device consists of fixed and movable diffractive sub-elements, micromachined in the device layer of a bonded silicon on insulator (BSOI) wafer. Switching between the(More)
Sensitive and selective gas measurements are crucial for a large variety of applications. This paper describes the manufacturing and characterization of a photoacoustic gas sensor system. The system is based on a pressure sensor element with a sensitivity of 10 muV/V/Pa. To demonstrate and evaluate the concept, 12 prototypes for measuring CO<sub>2</sub>(More)
Wafer-level thermocompression bonding (TCB) using aluminum (Al) is presented as a hermetic sealing method for MEMS. The process is a CMOS compatible alternative to TCB using metals like gold (Au) and copper (Cu), which are problematic with respect to cross contamination in labs. Au and Cu are commonly used for TCB and the oxidation of these metals is(More)
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