S. Kasaioka

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A f u l l y automatic LSI wi re-bonding system u t i l i z i n g image processing techniques is descr ibed. The p o s i t i o n recogn i t i on system developed is composed of measuring s t a t i o n s , a r ecogn i t i on dev ice , a minicomputer, and cassette taperecorders . The p o s i t i o n of the bonding pad is found, genera l l y in r e a l t i m e(More)
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