S. J. Chua

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This paper analyses a few key yield and reliability challenges of the back-end-of-line (BEOL) interconnects. A discussion of the failure modes and mechanisms are elaborated on challenges arising from weak patterning, missing trench and plasma charging effect. Enhancement of via and bond pad reliability are also discussed
ZnO thin films have been grown by radio-frequency magnetron sputtering on c-plane sapphire substrates with III-V (i.e., GaAs and InAs) intermediate layers. The intermediate layers were grown by molecular beam epitaxy. Structural and optical properties were studied by X-ray diffraction (XRD) and Raman scatterings. The growth orientations of the(More)
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