S. Intachai

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Due to the smaller size of HDD, fault deformation of solder bumps is found more often. In order to study about a factor relating to fault deformation of solder bumps, the FEM is used to investigate stress performance. The results show that a small number of bumps positioned in a symmetric form have similar stress while a small number of bumps positioned in(More)
Fault deformation of IC die components is likely found during the manufacturing process due to the smaller size of components. Therefore, this study aims to use the analytical method for analysis of bump shape change in the symmetrical and asymmetrical pattern. In particular, the asymmetrical pattern is focused since it is commonly found in the production(More)
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