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Journals and Conferences
Precise measurement in the nanometer range is a challenge. This paper presents the metrology to measure the surface roughness on a flip-chip substrate using AFM and optical profiler. The effects of probe geometry, parameters, and repeatability on AFM measurements are investigated. Correlation results between AFM and optical profiler are studied.
This paper studied the effects of polyimide surface morphology and RIE treatment for lead-free C4 bumping of SOI device on assembly process by flip-chip technique. The characterizations were experimentally carried out with FTIR, AFM and CSAM. The process sequences have been optimized based on the DOE results.
A back-side de-processing process by chemical mechanical polishing (CMP) is developed. The process has been optimized to produce repeatable results. The process is capable of exposing the circuitry of the die uniformly and is able to target more than one area for units with multiple defect locations; front-side de-processing process has difficulty achieving… (More)