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Precise measurement in the nanometer range is a challenge. This paper presents the metrology to measure the surface roughness on a flip-chip substrate using AFM and optical profiler. The effects of probe geometry, parameters, and repeatability on AFM measurements are investigated. Correlation results between AFM and optical profiler are studied.
A back-side de-processing process by chemical mechanical polishing (CMP) is developed. The process has been optimized to produce repeatable results. The process is capable of exposing the circuitry of the die uniformly and is able to target more than one area for units with multiple defect locations; front-side de-processing process has difficulty achieving(More)
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