S. Bontemps

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This paper received the Best Paper Award at PCIM 2008, sponsored by PEE. It describes experimental results concerning the ageing of 600V IGBTs under repetitive short circuit conditions. A critical energy, which is dependent on test conditions, has been already pointed out which separates two failure modes. The first, with a cumulative degradation effect,(More)
In order to accelerate the ageing of the metallization layer of power semiconductor devices, repetitive short circuit operations are applied to COOLMOS TM Transistors. Regularly, during repetition of short-circuit operations metallization is observed in a Scanning Electron Microscope which allows us to observe the process of cracking at the grain boundaries(More)
In avionic area, the trend is to a growing use of power electronics systems. In this context, we present results concerning test vehicles (power modules) in order to improve a device assembly technology dedicated to be located "on the engine", in harsh operating conditions with thermal cycling from -50degC to 200degC in the worst case. The paper focuses on(More)
L'amélioration de la tenue à la fatigue thermique des assemblages d'électronique de puissance à base d'alliages de brasage pour les applications transport (automobile, ferroviaire et aéronautique) est essentielle du fait de l'évolution vers de plus hautes températures de l'environnement de fonctionnement des modules de puissance. Depuis plusieurs années, le(More)
Revues internationales avec comité de lecture 2013 Chamoin, L., Desvillettes, L. Control of modeling errors in the coupling of linear transport and diffusion models. A first approach to characterize the surface integrity generated by ball-end finishing milling, A study of the effect of degradation of the aluminium metallization layer in the case of power(More)
Due to RoHS restrictions, researches on lead-free packaging have increased over the past decade. Low Temperature Joining Techniques (such as silver sintering or Ni-Au Transient Liquid Phase Bonding) are particularly studied because they are processed below 300°C and the attaches obtained are reliable at high temperature. Silver paste sintering(More)
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