Ryszard Kisiel

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The aim of the work is to investigate the resistance stability of through holes filled by electrically conductive adhesives. The double sided PCB thickness 0.6 mm, with the holes diameters: 0.3 mm, 0.5 mm and 0.8 mm were filled by new series of electrically conductive adhesives. The new adhesives have the filler in form of mixture of Ag flakes micrometer(More)
One of the key problems for more efficient use of conventionally PCBs is plated through holes, because they consume a large fraction of PCB surface area. One of the solutions that can permit to save the PCB surface is using of blind and buried vias. Currently, many expensive plating and sequential lamination steps create the blind/buried vias. Electrically(More)
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