Ruth Treml

We don’t have enough information about this author to calculate their statistics. If you think this is an error let us know.
Learn More
Nanoscale, multi-material thin film structures are commonly used in the design of microelectronic devices. Composites like these have the advantage of occupying a small volume in a specific device which makes a realization of 3D integrated circuits easier. Nonetheless, an arbitrarily fabricated thin film component will not automatically meet the(More)
Novel design of microelectronic components creates new issues concerning their reliability. Internal mechanical loading, e.g. from residual stresses, or external loading when the component is assembled into a microelectronic device, can cause failure via cracking or delamination. In this work, finite element simulations of micro-beam bending experiments for(More)
A microelectronic device, designed from multiple structured thin films of different materials deposited on each other, can have a very complex shape. Such a structure can show relatively high residual stresses, which lead to malfunctions and a decrease in lifetime of the device. In this paper a numerical method relying on an inverse optimization algorithm(More)
  • 1