Learn More
$ %& ' ' )( +*, '. (/ . 0213 4 '.3 ' ./ 5 , 6 78 / 9( ' : 4 ; =<&# >0>"4 > .? , %@ 5A( %B(C D(/ "E FG , %& 5A( "'( FG 9 / '# 6 H( I ' 2 #4 + J;#' 2 H*, '.K( *'0 L I(/ IM, %@ @ #' / 9(/ "N( * # O ' . 1/ ' #' 45 / P Q ' , / ) 7R ' S I ' P '( O(C S , >* 0 L7T / ) 2 U ) '(/ , O ; V HW@(/ X 0 L C X 6 )%V > I K( > B -"4 5 "4#' Y ' ( # ( 0Z #' ; Q , %@ H"4 > '((More)
Recent efforts to address microprocessor power dissipation through aggressive supply voltage scaling and power management require that designers be increasingly cognizant of power supply variations. These variations, primarily due to fast changes in supply current, can be attributed to architectural gating events that reduce power dissipation. In order to(More)
Three-dimensional integration has the potential to improve the communication latency and integration density of chip-level multiprocessors (CMPs). However, the stacked high-power density layers of 3D CMPs increase the importance and difficulty of thermal management. In this paper, we investigate the 3D CMP run-time thermal management problem and describe(More)
Increasing focus on power dissipation issues in current microprocessors has led to a host of proposals for clock gating and other power-saving techniques. While generally effective at reducing average power, many of these techniques have the undesired side-effect of increasing both the variability of power dissipation and the variability of current drawn by(More)
While transistor performance and energy efficiency have dramatically improved in recent years, electrical interconnect improvements has failed to keep pace. Recent advances in nanophotonic fabrication have made on-chip optics an attractive alternative. However, system integration challenges remain. In particular, the parameters of on-chip nanophotonic(More)
......System integration and performance requirements are dramatically increasing the power consumptions and power densities of high-performance microprocessors; some now consume 100 watts. High power consumption introduces challenges to various aspects of microprocessor and computer system design. It increases the cost of cooling and packaging design,(More)
The emergence of power as a first-class design constraint has fueled the proposal of a growing number of run-time power optimizations. Many of these optimizations trade-off power saving opportunity for a variable performance loss which depends on application characteristics and program phase. Furthermore, the potential benefits of these optimizations are(More)
Circuit-level timing speculation has been proposed as a technique to reduce dependence on design margins and eliminating power/performance overheads. Recent work has proposed microarchitectural methods to dynamically detect and recover from timing errors in processor logic. To a large extent existing work has relied on statistical error models and has not(More)
By adjusting the design of the ISA and enabling circuit timing-sensitive optimizations in a compiler, we can more effectively exploit timing speculation. While there has been growing interest in systems that leverage circuit-level timing speculation to improve the performance and power-efficiency of processors, most of the innovation has been at the(More)
In a few technology generations, limitations of fabrication processes will make accurate design time power estimates a daunting challenge. Static leakage current which comprises a significant fraction of total power due to large on-chip caches, is exponentially dependent on widely varying physical parameters such as gate length, gate oxide thickness, and(More)