Ruei-Siang Hsu

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—Since packages affect the amount of heat transfer, it is important to include package and heat sink in thermal analysis. In this paper, we study the full-chip thermal response with different packages. We first discuss the difficulties of obtaining accurate package models for simulation. To facilitate a designer to perform thermal simulation with different(More)
A stacked-die product integrates multiple dies on interposers. In this paper, we first discuss the difficulties of traditional testing mechanism for interposers. To improve production yield, a contactless testing mechanism for pre-bond interposers is proposed. Our testing mechanism attempts to detect a defective interposer from the thermal image after(More)
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