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Transient dual interface measurement — A new JEDEC standard for the measurement of the junction-to-case thermal resistance
TLDR
A new transient measurement method for the junction-to-case thermal resistance Rth-JC of power semiconductor packages with a single heat flow path. Expand
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How to evaluate transient dual interface measurements of the Rth-JC of power semiconductor packages
TLDR
We present a detailed investigation of the correlation between the Rth-JC and the point of separation of the Zth-curves. Expand
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Development of a standard for transient measurement of junction-to-case thermal resistance
TLDR
The paper summarizes the development of a standard to measure the thermal resistance “junction-to-case” θ<inf>JC</inf> of semiconductor devices with heat flow through a single path with different cooling conditions at the interface of device case and a heat sink. Expand
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Development of a standard for transient measurement of junction-to-case thermal resistance
The paper summarizes the development of a standard to measure the thermal resistance “junction-to-case” θ JC of semiconductor devices with heat flow through a single path. Power switches orExpand
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