Rowin V. Galarce

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With the growing complexity of Integrated Circuit (IC) design having multiple metallization layers and copper wire bonded devices, most of the time backside fault isolation is a better approach. This paper evaluated wet chemical backside sample preparation as an alternative method for the traditional milling/polishing backside sample preparation.
There is a recent influx of failures on an automotive device particularly on a Monolithic Step-Up DC-DC Converter. Difficulty arises on the defect localization of the metal stringer since majority of the failing units have different electrical signatures wherein some returned units are failing at field, 0Km failure or failing at higher temperature which was(More)
There is a recent failure on a Low-Dropout Voltage Regulator with Reset Automotive Device of which customer is experiencing an out of specification output voltage. This paper aims to pinpoint the exact failure mechanism for this automotive customer using detailed fault localization analysis and identify the root cause of broken stitch bond.
There are recent failures on a Low Dropout (LDO) Regulator where the customer is experiencing an out of specification output voltage. This paper aims to investigate the exact root cause of the failure by detailed failure analysis and relating the customer complaint to the die crack observed.
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