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The yeast Saccharomyces cerevisiae has a finite replicative life span. Yeasts possess two prohibitins, Phb1p and Phb2p, in similarity to mammalian cells. These proteins are located in the inner mitochondrial membrane, where they are involved in the processing of newly-synthesized membrane proteins. We demonstrate that the elimination of one or both of the(More)
Aberrant expression of the amyloid precursor protein (APP) gene may contribute to the beta-amyloid deposition seen in Alzheimer's disease and Down syndrome patients. Genomic DNA was isolated from human brain tissue and digested with HpaII, an enzyme sensitive to CpG methylation. Southern-blot analysis revealed the absence of methylation at a site in the APP(More)
I n recent years, incretin-based therapies such as glucagon-like peptide-1 agonists (GLP-1) and dipeptidyl peptidase-IV inhibitors (DPP-IV) have become important therapeutic options for treatment of type 2 diabetes. Although these agents are considered safe, long-term safety outcome studies are lacking. Theoretically, the combination of these two classes of(More)
Objective. To report a case of diabetic muscle infarction (DMI), a rare complication of long-standing poorly controlled diabetes mellitus. Methods. We describe a case of a 45-year-old male with an approximately 8-year history of poorly controlled type 2 diabetes mellitus with multiple microvascular complications who presented with the sudden onset of left(More)
The Facilities Manager occupies a unique position within the lifecycle of a building asset, as he/she is one of the only Architecture/Engineering/Construction (AEC) and Facilities Management (FM) professionals who is in a position to view the product of the entire design and build process and is responsible for the operational phase which incurs(More)
This paper reviews the rationale for using a partial data set in Building Information Modeling (BIM) exchanges, influenced by the recognized difficulty of exchanging data at element or object level which depends on the information requiring compatible hardware and software, in order for the data to be read and transferred freely between applications. The(More)
The potential failure in through-silicon vias (TSVs) still poses a challenge in trying to extend the useful life of a 3D integrated circuit (IC). A model is proposed to mitigate the communication problem in 3D integrated circuits caused by the breaks at the TSVs. We provide the details of a low-complexity network that takes advantages of redundant TSVs to(More)