Roberto Zafarana

  • Citations Per Year
Learn More
Adhesion and interface compositions of epoxy phenolic molding compounds (EMCs) for high-temperature plastic packages are studied. Interfaces are obtained by molding two EMCs onto aluminum oxide-hydroxide surfaces (oxide onto thin film of AlSiCu) and two die passivation layers consisting of fluorinated polyimide and cyclotene. One compound (A) is a(More)
Thermal and electrical performances of two conductive adhesive materials loaded with Ag particles suitable for power die bonding have been studied. The study has been performed using dice of Power MOSFETs having an area higher than 30 mm<sup>2</sup> assembled in TO220 package in comparison with Pb95.5-Sn2-Ag2.5 (wt.%) soft solder as reference; the(More)
  • 1