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  • Chuan Xu, Vassilis Kourkoulos, Roberto Suaya, K. C. Banerjee
  • Physics
  • IEEE Transactions on Electron Devices
  • 2011 (First Published: 1 October 2011)
  • This paper introduces a fully analytical and physical model capable of extracting high-frequency series impedance of through-silicon vias (TSVs) in 3-D integrated chips with consideration of the eddyContinue Reading